cystech electronics corp. spec. no. : c847n3 issued date : 2003.07.02 revised date :2013.01.03 page no. : 1/6 btd2098n3 cystek product specification low vcesat npn epitaxial planar transistor btd965n3 features ? low v ce (sat), v ce (sat)=0.35 v (typical), at i c / i b = 3a / 0.1a ? excellent dc current gain characteristics ? complementary to btb1386n3 symbol outline absolute maximum ratings (ta=25 c) parameter symbol limits unit collector-base voltage v cbo 40 v collector-emitter voltage v ceo 20 v emitter-base voltage v ebo 7 v collector current (dc) i c 5 a collector current (pulse) i cp 8 (note ) a power dissipation pd 225 mw thermal resistance, junction to ambient r ja 556 c/w junction temperature tj 150 c storage temperature tstg -55~+150 c note : single pulse pw Q 350 s, duty Q 2%. btd965n3 b base c collector e emitter sot-23
cystech electronics corp. spec. no. : c847n3 issued date : 2003.07.02 revised date :2013.01.03 page no. : 2/6 btd2098n3 cystek product specification characteristics (ta=25 c) symbol min. typ. max. unit test conditions bv ceo 20 - - v i c =1ma, i b =0 bv ebo 7 - - v i e =10 a, i c =0 i cbo - - 0.1 a v cb =10v, i e =0 i ceo - - 1 a v cb =10v, i e =0 i ebo - - 0.1 a v eb =7v,i c =0 *v ce(sat) - 0.35 1.0 v i c =3a, i b =0.1a *h fe 1 230 - 800 - v ce =2v, i c =500ma *h fe 2 150 - - - v ce =2v, i c =2.00a f t - 150 - mhz v ce =6v, i e =50ma, f=200mhz cob - - 50 pf v cb =20v, i e =0a, f=1mhz *pulse test : pulse width 380 s, duty cycle 2% classification of h fe 1 rank q r s range 230~380 340~600 400~800 ordering information device hfe rank package shipping BTD965N3-Q-T1-G q sot-23 (pb-free lead plating and halogen-free package) 3000 pcs / tape & reel btd965n3-r-t1-g r sot-23 (pb-free lead plating and halogen-free package) 3000 pcs / tape & reel btd965n3-s-t1-g s sot-23 (pb-free lead plating and halogen-free package) 3000 pcs / tape & reel
cystech electronics corp. spec. no. : c847n3 issued date : 2003.07.02 revised date :2013.01.03 page no. : 3/6 btd2098n3 cystek product specification characteristic curves current gain vs collector current 10 100 1000 1 10 100 1000 10000 collector current---ic(ma) current gain---hfe vce=5v vce=1v vce=2v saturation voltage vs collector current 1 10 100 1000 1 10 100 1000 10000 collector current---ic(ma) saturation voltage---(mv) ic=10ib vce(sat) ic=30ib ic=50ib ic=40ib saturation voltage vs collector current 100 1000 10000 1 10 100 1000 10000 collector current---ic(ma) saturation voltage---(mv) vbe(sat) @ ic=10ib power derating curve 0 50 100 150 200 250 0 50 100 150 200 ambient temperature---ta() power dissipation---pd(mw)
cystech electronics corp. spec. no. : c847n3 issued date : 2003.07.02 revised date :2013.01.03 page no. : 4/6 btd2098n3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c847n3 issued date : 2003.07.02 revised date :2013.01.03 page no. : 5/6 btd2098n3 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c847n3 issued date : 2003.07.02 revised date :2013.01.03 page no. : 6/6 btd2098n3 cystek product specification sot-23 dimension *:typical inches h j k d a l g v c b 3 2 1 s style : pin 1.base 2.emitter 3.collector 3-lead sot-23 plastic surface mounted package cystek package code: n3 marking: product code date code: year+month year: 3 2003, 4 2004 month: 1 1, 2 2, ??? 9 9, a 10, b 11, c 12 ah millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1102 0.1204 2.80 3.04 j 0.0034 0.0070 0.085 0.177 b 0.0472 0.0630 1.20 1.60 k 0.0128 0.0266 0.32 0.67 c 0.0335 0.0512 0.89 1.30 l 0.0335 0.0453 0.85 1.15 d 0.0118 0.0197 0.30 0.50 s 0.0830 0.1161 2.10 2.95 g 0.0669 0.0910 1.70 2.30 v 0.0098 0.0256 0.25 0.65 h 0.0005 0.0040 0.013 0.10 notes : 1.controlling dimension : millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material : ? lead :pure tin plated. ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cysrek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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